High Density Board - List of Manufacturers, Suppliers, Companies and Products

High Density Board Product List

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High-speed signal, high-density substrate "Back Drill Substrate"

High-speed signal, high-density substrate "Back Drill Substrate"

Providing high-speed transmission boards with better characteristics! Applications include base stations, communication devices, and high-speed routers.

We would like to introduce our high-speed signal and high-density substrate, the "Back Drill Substrate." By removing unnecessary through-hole stubs through back drilling, we eliminate signal disturbances. Furthermore, it becomes possible to reduce attenuation, allowing us to provide high-speed transmission substrates with better characteristics. 【Features】 ■ Back drilling ■ Capability to eliminate signal disturbances and reduce attenuation *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate "Build-up substrate"

High-speed signal, high-density substrate "Build-up substrate"

Build-up structure! Supports various interlayer connections with laser VIA, IVH, and through VIA.

We would like to introduce our high-speed signal and high-density substrate, the "Build-Up Substrate," which we handle. It supports build-up substrates from 4 layers to 16 layers, and thanks to its build-up structure, it accommodates various interlayer connections using laser vias, IVH, and through vias. It enables the mounting of narrow-pitch components and high-density designs. Please feel free to consult us when you need assistance. 【Features】 ■ Supports build-up substrates from 4 layers to 16 layers ■ Enables the mounting of narrow-pitch components and high-density designs *For more details, please refer to the PDF document or feel free to contact us.

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High-speed signal, high-density substrate 'IVH substrate'

High-speed signal, high-density substrate 'IVH substrate'

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate." By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when needed. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

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